High-Purity Copper for Semiconductors: Interconnect Architecture...

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2026-07-06 06:57:22

High-Purity Copper for Semiconductors: Interconnect Architecture at Sub-3nm Nodes

The history of semiconductor manufacturing is defined by the constant effort to cram more transistors onto a single silicon wafer. As microprocessors approach sub-3-nanometer processing nodes, the physical limitations of raw materials present severe engineering challenges. A primary obstacle is interconnect resistance—the electrical resistance encountered by signals traveling through the...

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