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amitpatil добавлена новая статья Другое
2025-11-27 07:00:21 -

3D IC Market: Advanced Semiconductor Packaging Powering the Next-Gen Computing Era
According to a new report published by Introspective Market Research, titled, “3D IC Market by Integration Type, Application, and End User,” The Global 3D IC Market Size Was Valued at USD 15.91 Billion in 2023 and is Projected to Reach USD 82.73 Billion by 2032, Growing at a CAGR of 20.10%. Introduction / Market Overview The 3D IC Market is rapidly transforming the...

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HarshalJ добавлена новая статья Другое
2025-09-12 15:00:37 -

Long-Term Outlook of the Advanced Packaging Market
The advanced packaging market has seen considerable expansion, prompting detailed advanced packaging market analysis to understand regional trends, applications, and competitive dynamics. This analysis highlights the adoption of 3D ICs, system-in-package (SiP) solutions, and wafer-level packaging as key growth drivers. The advanced packaging industry benefits from...

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